Investigation of the influence of packaging cardboard surface topography on the quality of printed products

Authors

  • M.O. Ohirko Chernivtsi National University named after Yu. Fedkovicha
  • O.G. Ushenko Chernivtsi National University named after Yu. Fedkovych
  • O.V. Dubolazov Chernivtsi National University named after i Fedkovych
  • I.V. Soltys Chernivtsi National University named after i Fedkovych
  • Y.M. Struk Yuriy Fedkovych Chernivtsi National University

DOI:

https://doi.org/10.31649/1681-7893-2024-48-2-135-140

Keywords:

packaging cardboard, surface topography, roughness, offset printing, adhesion

Abstract

The article investigates the impact of surface topography of various types of packaging cardboard on the quality of offset printed impressions. It analyzes the morphological structure of coated (GD2) and uncoated (UD3) cardboard, their microstructure, as well as surface roughness parameters such as Ra, peak, and valley areas. The article also provides a comparative analysis of the morphological indicators of unprinted cardboard surfaces and their printed impressions. Recommendations are proposed for selecting packaging materials to ensure optimal print quality.

Author Biographies

M.O. Ohirko , Chernivtsi National University named after Yu. Fedkovicha

PhD, Assistant 

O.G. Ushenko , Chernivtsi National University named after Yu. Fedkovych

DSc.,Professor

O.V. Dubolazov , Chernivtsi National University named after i Fedkovych

DSc., Professor

I.V. Soltys , Chernivtsi National University named after i Fedkovych

 PhD, Associate professor 

Y.M. Struk, Yuriy Fedkovych Chernivtsi National University

PhD, Associate professor

References

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Published

2024-11-16

How to Cite

[1]
M. Ohirko, O. Ushenko, O. Dubolazov, I. Soltys, and Y. Struk, “Investigation of the influence of packaging cardboard surface topography on the quality of printed products ”, Опт-ел. інф-енерг. техн., vol. 48, no. 2, pp. 135–140, Nov. 2024.

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Section

Optical and Quantum Electronics in Computer and Intellectual Technologies

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